Samsung Electro-Mechanics has stretched MLCC order lead times to 52 weeks this month, with low-capacitance, high-capacitance and automotive grades all queuing for allocation. AI servers use more than ten times the MLCC count of standard servers, while factory prices for high-capacitance parts climbed 15 percent to 35 percent. Murata has issued an end-of-life notice covering nine series.

Samsung Electronics will use the TSMC 3nm process to make base dies for Nvidia custom NVHBM chips, joining SK Hynix and Micron under one manufacturing standard for the next generation of AI memory. The report also shows Samsung foundry losses narrowing by 41 percent.

The 2026 Bay Area Semiconductor Industry Ecology Expo opened in Shenzhen on October 14. The show covers nearly 80,000 square meters and gathers more than 1,000 exhibitors, up 66 percent year on year. Over 40 forums, 30 matchmaking sessions and meetings with 43 core fab buyers run in parallel.

Samsung Electronics released preliminary Q3 results on October 8: operating profit of about KRW 107.4 trillion, up 782.5% year on year, with the memory business contributing an estimated KRW 109 trillion; DRAM ASP rose 20.1% sequentially and NAND 19%. TrendForce expects Q4 conventional DRAM contract prices to rise 10%-15% and NAND Flash 15%-20%. YMTC holds a 14% NAND market share as its third Wuhan fab starts up by end-2026, while supply tightness may persist toward 2030.

Semiconductor Industry Observation reported on September 28 that TrendForce expects global top-ten foundry 8-inch average capacity utilization to rise to 88% in 2026 and reach 90% in the second half. UMC has initiated selective price adjustments and signaled larger 2027 hikes; Vanguard's Q3 ASP continues to rise; PSMC has adjusted some product prices. AI server spillover demand is driving PMICs, MCUs and power devices on mature processes, with global mature-node wafer pricing set to enter a volu

Reuters reported on September 18 that CXMT plans a NAND flash R&D line at its new Beijing fab, has set up a research institute covering NAND development, and has opened supply talks with AI and supercomputer storage customers. CXMT's Q2 DRAM revenue hit US$14.62 billion, up 99.3% QoQ, lifting its market share to 9.5%. With Samsung, SK Hynix and Micron prioritizing DRAM and HBM, TrendForce sees NAND tightness persisting into H2 2027 — buyers should lock volumes early.

Channel and market data confirmed on September 14 that TLVR coupled inductors for AI server power delivery are up 45%-70% this year, with scarce part numbers up 150% on spot. Murata is discontinuing consumer- and automotive-grade MLCC part numbers across nine series, shifting capacity to high-capacitance AI-server products with lead times now 20-26 weeks versus 8-10 weeks. Analysts expect the high-capacitance MLCC gap to persist into 2028 as passive-component pricing turns structural.

Renesas Electronics announced on September 10 a new pricing structure effective January 1, 2027 — its second hike this year, citing structural cost inflation in materials, energy, advanced packaging and capacity. With Infineon, Texas Instruments, CR Micro and Silan all raising prices multiple times, mainstream power-semiconductor lead times now exceed 30 weeks, and further increases are expected in H2 as procurement shifts to locking volume and delivery.

China Resources Microelectronics confirmed two rounds of product price hikes in February and July, and H1 SiC revenue more than doubled year on year, with automotive and energy-storage at about 85% of the total. The company expects the power-semiconductor supply-demand gap to widen into an extended upcycle, named MEMS sensors and optical chips its third growth curve, and plans 12-inch capacity release in 2027.