Samsung Electro-Mechanics raises all MLCC prices 30% from August 1, with Taiyo Yuden following on September 1. On the same day, Wcheon Electronics files ChiNext IPO to raise 1.675 billion yuan for high-end MLCC expansion. AI server MLCC demand reaches 10-15x traditional servers, with high-end shortage projected at 15-20% in H2 2026, accelerating the domestic substitution window.

Microsoft plans to unveil its in-house Maia 300 AI chip this fall, with negotiations underway to secure over 300,000 units from TSMC for 2027 delivery and a long-term target of one million. The move marks hyperscaler custom silicon transitioning from validation to volume substitution, driving sustained demand for high-voltage MOSFETs, PMICs, and MLCCs across AI server builds.

Sony and TSMC are jointly investing approximately USD 6.4 billion to build an image sensor fab in Kumamoto, with Sony holding 60% and TSMC 40%. Next-generation products are targeted for mass production in 2029, focusing on robotics, automotive cameras, and physical AI. The partnership will reshape the global high-end image sensor supply landscape and drive demand for MEMS microphones, automotive PMICs, and passive components.