Huawei, Xiaomi and Honor raised prices on multiple in-market smartphones by RMB 200 to RMB 1,000 on September 1. TrendForce data shows memory prices have climbed 5–7x since early 2025, and a 12GB/256GB configuration reportedly jumped to about RMB 2,200. DRAM has overtaken the SoC in per-unit cost within a flagship phone, lifting memory's share of total BOM to 30%-40%. The squeeze is reshaping BOM budgets across consumer electronics and opening substitution windows for domestic component distribu

CanSemi Semiconductor's ChiNext IPO registration was cleared on August 28 by the CSRC, paving the way for approximately RMB 7.5 billion in fundraising and making the foundry the first wafer fab to list under ChiNext's registration-based reform. CanSemi earmarks RMB 3.5 billion for capacity expansion and RMB 2.5 billion for silicon photonics and compute-in-memory R\&D, lifting 12-inch monthly output from 63,300 wafers to 120,000 wafers. As China's only high-volume 12-inch silicon photonics line s

On August 21, Amazon raised prices across its hardware lineup, with the Echo Dot up 60%, Fire TV Stick 4K Max up 41.7%, and Kindle 16 GB up 36.4%, citing surging memory and storage component costs. TrendForce forecasts Q3 DRAM contract prices to rise 13%–18% and NAND Flash 10%–15%, confirming the AI-driven storage shortage has reached consumer shelf prices.

Taiwan power-semi makers plan a third 2026 price hike, raising non-contract spot prices 10%–15% from October, after 1H 2026 average prices already rose 15%–20% YoY and lead times on high-power MOSFETs and large-area TVS diodes stretched to 52 weeks. AI rack power is scaling from 120kW toward 1MW, making 800 VDC the definitive architecture for next-generation AI factories, and the AI data-center power-semi market is being revised from US 12𝐵𝑡𝑜𝑈𝑆 50B. Structural tightness opens a substitution

Samsung Electro-Mechanics raises all MLCC prices 30% from August 1, with Taiyo Yuden following on September 1. On the same day, Wcheon Electronics files ChiNext IPO to raise 1.675 billion yuan for high-end MLCC expansion. AI server MLCC demand reaches 10-15x traditional servers, with high-end shortage projected at 15-20% in H2 2026, accelerating the domestic substitution window.

Microsoft plans to unveil its in-house Maia 300 AI chip this fall, with negotiations underway to secure over 300,000 units from TSMC for 2027 delivery and a long-term target of one million. The move marks hyperscaler custom silicon transitioning from validation to volume substitution, driving sustained demand for high-voltage MOSFETs, PMICs, and MLCCs across AI server builds.

Sony and TSMC are jointly investing approximately USD 6.4 billion to build an image sensor fab in Kumamoto, with Sony holding 60% and TSMC 40%. Next-generation products are targeted for mass production in 2029, focusing on robotics, automotive cameras, and physical AI. The partnership will reshape the global high-end image sensor supply landscape and drive demand for MEMS microphones, automotive PMICs, and passive components.